Title:
印刷回路基板用穿孔加工シート
Document Type and Number:
Japanese Patent JP5543431
Kind Code:
B2
Abstract:
The present invention relates to a sheet for perforation that is used for perforation processing, which is one of the processes of manufacturing a printed-circuit board. Specifically, the present invention relates to a sheet for perforation use, wherein an organic resin layer that contains an ethylene type copolymer, a polyolefin type resin with a low melting point, and a compatibilizer is laminated with a metal layer by means of a thermosetting adhesive, and a method for manufacturing a printed-circuit board comprising a process that arranges this sheet as a cover plate on the surface of the drill entry side of a printed-circuit board, on which one or more layers are laminated, and perforation is carried out using the drill.
Inventors:
Hong, プ Gin
Choi, Sun Bon
Choi, Sun Bon
Application Number:
JP2011504938A
Publication Date:
July 09, 2014
Filing Date:
May 07, 2009
Export Citation:
Assignee:
Eye. S Tech Company リミティッド
International Classes:
B26F1/16; B23B35/00; B23B41/00; B32B15/085; H05K3/00
Attorney, Agent or Firm:
Takashima 1
Kyoko Doi
Kamata 光宜
Tamura Yasaka child
Kenji Yamamoto
Murata Miyuki
Kyoko Doi
Kamata 光宜
Tamura Yasaka child
Kenji Yamamoto
Murata Miyuki
Previous Patent: オレフィン類重合用固体触媒成分および触媒並びにこれを用いたオレフィ...
Next Patent: USING FARE COLLECTING AND COUNTING DEVICE FOR COPYING MACHINE
Next Patent: USING FARE COLLECTING AND COUNTING DEVICE FOR COPYING MACHINE