Title:
A radiation method of a wiring board with built-in parts, and a wiring board with built-in parts
Document Type and Number:
Japanese Patent JP6007566
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To efficiently radiate heat from an electronic component thereby resolving problems such as destruction of a mounting portion due to the heat generated from the electronic component in a component built-in wiring board formed by burying the electronic component in an insulation member.SOLUTION: A component built-in wiring board is formed so as to include: at least a pair of wiring layers; an insulation member disposed between the pair of wiring layers; an electronic component buried in the insulation member; and a metal body that is disposed in the insulation member, the metal body where a recessed part for housing a non active surface and a side surface of the electronic component is formed.
Inventors:
Toru Serizawa
Tsuyoshi Tsunoda
Yuichi Yamamoto
Tsuyoshi Tsunoda
Yuichi Yamamoto
Application Number:
JP2012095732A
Publication Date:
October 12, 2016
Filing Date:
April 19, 2012
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H05K3/46; H01L23/12; H05K3/44
Domestic Patent References:
| JP2007103939A | ||||
| JP2008016653A | ||||
| JP2001274034A | ||||
| JP2010272563A | ||||
| JP2004134669A | ||||
| JP2010010640A | ||||
| JP4032251A | ||||
| JP2006073763A | ||||
| JP2007318047A |
Foreign References:
| US20120087097 |
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office