Title:
RESIN COMPOSITION AND RESIN MOLDING
Document Type and Number:
Japanese Patent JP2018053088
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition that makes it possible to obtain a resin molding having an excellent flexural modulus.SOLUTION: A resin composition has a resin composition containing a polyolefin, a carbon fiber, and a copolymer of a polyolefin and a polyamide.SELECTED DRAWING: None
Inventors:
OGOSHI MASAYUKI
MIYAMOTO TAKESHI
MORIYA HIROYUKI
MIYAMOTO TAKESHI
MORIYA HIROYUKI
Application Number:
JP2016190268A
Publication Date:
April 05, 2018
Filing Date:
September 28, 2016
Export Citation:
Assignee:
FUJI XEROX CO LTD
International Classes:
C08L23/02; C08J5/00; C08K7/06; C08L51/06
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office
Previous Patent: A resin composition and a resin-molding object
Next Patent: A resin composition and a resin-molding object
Next Patent: A resin composition and a resin-molding object