Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2023068335
Kind Code:
A
Abstract:
To provide a resin composition which can give a cured product having a low dielectric loss tangent and having high adhesion to a conductor layer after a HAST test.SOLUTION: The resin composition contains (A) an epoxy resin, (B) an active ester compound, (C) an inorganic filler, and (D) an antioxidant. When a nonvolatile component in the resin composition is 100 mass%, the content of the inorganic filler (C) is 60 mass% or more and the content of the active ester compound (B) is 10 mass% or more.SELECTED DRAWING: None
Inventors:
NAKAMURA YOSUKE
Application Number:
JP2021179337A
Publication Date:
May 17, 2023
Filing Date:
November 02, 2021
Export Citation:
Assignee:
AJINOMOTO KK
International Classes:
B32B27/38; C08G59/42; C08K3/013; C08L63/00; H05K1/03
Attorney, Agent or Firm:
Sakai International Patent Office
Previous Patent: JPWO2023068334
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