Title:
A resin molding apparatus and a resin molding method
Document Type and Number:
Japanese Patent JP6218666
Kind Code:
B2
Inventors:
Naomi Fujiwara
Tetsuya Yamada
Tomoyuki Goto
Junko Takada
Yasuhiro Iwata
Tetsuya Yamada
Tomoyuki Goto
Junko Takada
Yasuhiro Iwata
Application Number:
JP2014091596A
Publication Date:
October 25, 2017
Filing Date:
April 25, 2014
Export Citation:
Assignee:
towa corporation
International Classes:
H01L21/56; B29C43/34; B29C43/36
Domestic Patent References:
| JP6114867A | ||||
| JP11221511A | ||||
| JP2009039985A | ||||
| JP2008114428A |
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