Title:
A rigid flex time multilayer printed wiring board and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP6224337
Kind Code:
B2
Inventors:
Tetsuro Otsuka
Application Number:
JP2013076730A
Publication Date:
November 01, 2017
Filing Date:
April 02, 2013
Export Citation:
Assignee:
CMK Corporation
International Classes:
H05K3/46; H05K1/02
Domestic Patent References:
| JP2008034433A | ||||
| JP2005064059A | ||||
| JP2006128435A |
Attorney, Agent or Firm:
Alga Patent Office, a patent business corporation
Toshio Takano
Toshio Nakajima
Masaki Murata
Hiroto Yamamoto
Toshio Takano
Toshio Nakajima
Masaki Murata
Hiroto Yamamoto