Title:
SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR CHIP
Document Type and Number:
Japanese Patent JP2017050512
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor chip in which the impact of cracking or exfoliation, occurring from the dicing surface, on the characteristics of an integrated circuit is reduced, and to provide a semiconductor device and a manufacturing method for a semiconductor chip.SOLUTION: A semiconductor chip 1 includes a semiconductor substrate 201, a plurality of wiring layers 302 laminated on the semiconductor substrate 201, and a plurality of isolating layers 301 interposed between the plurality of wiring layers 302. The semiconductor chip has a semiconductor element 200 formed in a part of the semiconductor substrate 201 on the side where the isolating layers 301 are laminated, and has a trench 20 of a depth reaching the semiconductor substrate 201 or more, and penetrating the wiring layers 302 and isolating layers 301 in a laminating direction around the semiconductor element 200.SELECTED DRAWING: Figure 3
Inventors:
BANNO EIKO
OZEKI YOSHIHIKO
OZEKI YOSHIHIKO
Application Number:
JP2015175076A
Publication Date:
March 09, 2017
Filing Date:
September 04, 2015
Export Citation:
Assignee:
DENSO CORP
International Classes:
H01L21/301; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Kazuyuki Yahagi
Taihei Nonobe
Takanori Kubo
Taihei Nonobe
Takanori Kubo