Title:
A semiconductor closure agent and a semiconductor device
Document Type and Number:
Japanese Patent JP6196138
Kind Code:
B2
Abstract:
An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; and (D) 40 to 75 mass % of silica filler with an average particle size of 0.3 μm or more and 5 μm or less. The component (C) and the component (D) are contained by 40.1 to 77 mass % in total.
Inventors:
Kazuyuki Ohara
Tomoya Yamazawa
Hiroshi Kogoshi
Nobuyuki Abe
Tomoya Yamazawa
Hiroshi Kogoshi
Nobuyuki Abe
Application Number:
JP2013247267A
Publication Date:
September 13, 2017
Filing Date:
November 29, 2013
Export Citation:
Assignee:
Namics Co., Ltd.
International Classes:
C08L63/00; C08J3/22; C08K3/36; C08K9/06; H01L21/60; H01L23/29; H01L23/31
Domestic Patent References:
| JP20116618A |
Attorney, Agent or Firm:
Asahi Patent Office
Hiroshi Watanabe
Hiroshi Watanabe
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