Title:
A semiconductor compression method for resin sealing and a semiconductor compression apparatus for resin sealing
Document Type and Number:
Japanese Patent JP6143711
Kind Code:
B2
Inventors:
High-definition
Application Number:
JP2014114188A
Publication Date:
June 07, 2017
Filing Date:
June 02, 2014
Export Citation:
Assignee:
towa corporation
International Classes:
H01L21/56; B29C43/18; B29C43/32; B29C43/38
Domestic Patent References:
| JP2012187832A | ||||
| JP2013247315A | ||||
| JP2012000794A | ||||
| JP200012580A | ||||
| JP59153214U |