Title:
A semiconductor device, an exposure head, and an image forming device
Document Type and Number:
Japanese Patent JP6170458
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To allow a reflection of light emitted from a light emitting part to be suppressed more than before even with a simple structure.SOLUTION: A pad 47 for wire bonding is formed at a level difference part 45 lower than a front face 41 on which a light emitting part 42 is formed, and on the pad 47 for wire bonding is formed a ball part 50 of an Au wire 49. This allows the ball part 50 to retreat out of an irradiation range of light to be emitted from the light emitting part 42 and can prevent the light emitted from the light emitting part 42 from being reflected to the ball part 50. Further, since it is sufficient that the level difference part 45 lower than the front face 41 is formed and not necessary to form a shading wall as before, a reflection of the light emitted from the light emitting part 42 can be suppressed as much as possible even with a simple structure.
Inventors:
Takato Suzuki
Taishi Kanefuji
Taishi Kanefuji
Application Number:
JP2014066790A
Publication Date:
July 26, 2017
Filing Date:
March 27, 2014
Export Citation:
Assignee:
Oki Data Co., Ltd.
International Classes:
B41J2/447; B41J2/45; H04N1/036
Domestic Patent References:
| JP2004179641A | ||||
| JP2007136720A | ||||
| JP11216898A | ||||
| JP2007294876A | ||||
| JP2004249626A | ||||
| JP2003243696A | ||||
| JP2003182147A | ||||
| JP5037027A | ||||
| JP57169543U | ||||
| JP2006165521A |
Foreign References:
| US20020057324 |
Attorney, Agent or Firm:
Keiki Tanabe
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