半導体装置

Japanese Patent JP7186645

B2

To provide a semiconductor device capable of improving reliability thereof.SOLUTION: The semiconductor device comprises a mount base, a semiconductor chip, a connector, and a plurality of terminals. The semiconductor chip is disposed on the mount base and includes a semiconductor portion, a first electrode, and a second electrode. The plurality of terminals are electrically connected to the second electrode through the connector. The plurality of terminals are aligned in a first direction along an outer edge of a front side surface of the mount base on which the semiconductor chip is disposed, and extend in a second direction intersecting the first direction. The connector includes a first portion connected to the second electrode of the semiconductor chip, a second portion connected to an edge of each of terminals at a side of the mount base, and a third portion located between the first portion and the second portion. The third portion includes a region which inhibits thermal conduction from the second electrode to one terminal in proximity to the second electrode of the semiconductor chip between the one terminal and the second electrode.SELECTED DRAWING: Figure 1

Katsuya Sato
Toshihide Takahashi
Tetsuya Yamamoto

JP2019053441A

December 09, 2022

March 20, 2019

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Toshiba Corporation
Toshiba Electronic Devices & Storage Corporation

H01L23/29; H01L23/48

JP2016146457A
JP2016149516A
JP2009188329A
JP2012079733A
JP2009124082A

US20110214904
CN102017134A
US20160233150

Hyuga Temple Masahiko
Junichi Kozaki
Hiroshi Ichikawa
Satoshi Shirai
Uchida Keito
Takeuchi Isao

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