Title:
半導体装置
Document Type and Number:
Japanese Patent JP7208032
Kind Code:
B2
Abstract:
A semiconductor apparatus (100) comprising: an element substrate (101) including a plurality of semiconductor devices (151) adapted to detect or oscillate predetermined electromagnetic waves; and an electromagnetic shielding (104) in a mesh form disposed in front of a surface detecting or oscillating the predetermined electromagnetic waves in the element substrate (101) and formed of a conductive material, wherein a line width of the electromagnetic shielding (104) is not more than 1 mm or not more than a wavelength of the predetermined electromagnetic waves.
Inventors:
Toshifumi Yoshioka
Noriyuki Kaifu
Noriyuki Kaifu
Application Number:
JP2019011827A
Publication Date:
January 18, 2023
Filing Date:
January 28, 2019
Export Citation:
Assignee:
Canon Inc
International Classes:
H05K9/00; G01J1/02; G01J1/42; G01N21/17; G01N21/3581; H01L31/02
Domestic Patent References:
| JP2013171177A | ||||
| JP201477672A |
Foreign References:
| WO2007138813A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Shuwa Patent Office