Title:
半導体モジュール
Document Type and Number:
Japanese Patent JP7400896
Kind Code:
B2
Abstract:
The flow speed distribution of a refrigerant in a cooling apparatus is made uniform. A cooling apparatus provided includes: a top plate; a casing portion having a base plate facing the top plate, and a refrigerant delivery portion arranged between the top plate and the base plate, the casing portion provided with two opening portions to function as an inlet port through which a refrigerant is let into the refrigerant delivery portion and an outlet port through which the refrigerant is let out; a cooling fin portion arranged in the refrigerant delivery portion of the casing portion and between the two opening portions; and a loss adding portion arranged in the refrigerant delivery portion of the casing portion and between the cooling fin portion and at least one of the two opening portions, the loss adding portion generating pressure loss in the refrigerant passing therethrough.
Inventors:
Takahiro Koyama
Application Number:
JP2022125809A
Publication Date:
December 19, 2023
Filing Date:
August 05, 2022
Export Citation:
Assignee:
Fuji Electric Co., Ltd.
International Classes:
H01L23/473; H01L25/07; H01L25/18
Domestic Patent References:
| JP2017050375A | ||||
| JP52136358A | ||||
| JP2008251932A | ||||
| JP2006319046A |
Foreign References:
| WO2015177909A1 | ||||
| US20160210391 |
Attorney, Agent or Firm:
Patent Attorney Corporation RYUKA International Patent Office