Title:
The sensor system which has 3 half bridge structure
Document Type and Number:
Japanese Patent JP6101309
Kind Code:
B2
Abstract:
It is described a sensor system (100) and a method for sensing a physical quantity. The sensor system (100) comprises (a) a first sensor path (110) comprising a first first sensing element (RA1) and a second first sensing element (RA2) being connected in series between a first supply terminal (102) and a second supply terminal (104) and a first intermediate node (115) being provided in between the first first sensing element (RA1) and the second first sensing element (RA2); (b) a second sensor path (120) comprising a first second sensing element (RB1) and a second second sensing element (RB2) being connected in series between the first supply terminal (102) and the second supply terminal (104) and a second intermediate node (125) being provided in between the first second sensing element (RB1) and the second second sensing element (RB2); (c) a third sensor path (130) comprising a first third sensing element (RC1) and a second third sensing element (RC2) being connected in series between the first supply terminal (102) and the second supply terminal (104) and a third intermediate node (135) being provided in between the first third sensing element (RC1) and the second third sensing element (RC2); and (d) a signal processing device (150), which is connected with the first intermediate node (115), the second intermediate node (125) and the third intermediate node (135) and which is configured for processing, based on (a) a first electric variable (vha) being given at the first intermediate node (115), (b) a second electric variable (vhb) being given at the second intermediate node (125), and (c) a third electric variable (vhc) being given at the third intermediate node (135), an output signal (out) being indicative for the sensed physical quantity.
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Inventors:
Robert Meyer
Thomas Placenell
Michael Schoen Eich
Thomas Placenell
Michael Schoen Eich
Application Number:
JP2015123053A
Publication Date:
March 22, 2017
Filing Date:
June 18, 2015
Export Citation:
Assignee:
NXP B.V.
International Classes:
G01D5/12
Domestic Patent References:
| JP2012137457A | ||||
| JP2011069635A | ||||
| JP2006266999A |
Foreign References:
| WO2008029520A1 |
Attorney, Agent or Firm:
Kenji Sugimura
Tsubouchi Shin
Akiyoshi
Tsubouchi Shin
Akiyoshi