Title:
A silver sheet for junction, a manufacturing method for the same, and an electronic-parts joining method
Document Type and Number:
Japanese Patent JP6245933
Kind Code:
B2
Abstract:
[Problem] To provide a joining silver sheet that is capable of providing a high joining strength with a low pressure of 3 MPa or lower. [Means for Resolution] A joining silver sheet containing silver particles having a particle diameter of from 1 to 250 nm integrated by sintering, and having a capability of further undergoing sintering on heating and retaining the silver sheet at a temperature range of from T A to T B (°C) satisfying 270 ¤ T A < T B ¤ 350. The silver sheet may be manufactured by a method of subjecting a coated film of a silver paste containing silver powder containing silver particles having a particle diameter of from 1 to 250 nm, and a dispersion medium that undergoes volatilization in a temperature range of 200°C or lower, which are mixed with each other, to a heat treatment at a temperature range, at which no sintering occurs, and then baking at a temperature of from 170 to 250°C under application of a pressure of from 5 to 35 MPa.
Inventors:
Kurita Satoshi
Keiichi Endo
Hiromasa Miyoshi
Keiichi Endo
Hiromasa Miyoshi
Application Number:
JP2013216150A
Publication Date:
December 13, 2017
Filing Date:
October 17, 2013
Export Citation:
Assignee:
dowa Electronics Co., Ltd.
International Classes:
H01B5/02; B22F1/054; B22F1/107; B22F3/10; B22F5/10; B22F9/00; H01B13/00; H01L21/52
Domestic Patent References:
| JP63186434A | ||||
| JP2008212976A | ||||
| JP2007083288A | ||||
| JP2005205696A |
Attorney, Agent or Firm:
Komatsu Taka
Kenji Wada
Kenji Wada
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