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Patent Searching and Data


Title:
A structure provided with the mounting structure and the mounting structure of a lamination rubber body
Document Type and Number:
Japanese Patent JP6060124
Kind Code:
B2
Abstract:
Disclosed is an attachment structure for a layered rubber body. Said attachment structure minimizes the installation height of the layered rubber body, prevents vertical tensile forces from acting on the layered rubber body, and makes it possible to replace the layered rubber body using a low amount of jack-up. The provided structure attaches a layered rubber body (8) to a top structure (2) and a bottom structure (3). Said layered rubber body is formed by joining a flange plate (6) to a layered rubber section (4), said flange plate having an extension section (6a) that extends further outwards than the outer edge of the layered rubber section (4). The disclosed attachment structure (1) is provided with: an upper anchor plate (10A) affixed to the bottom surface of the top structure (2); a lower anchor plate (10B) affixed to the top surface of the bottom structure (3); and shear keys (12) that engage with the upper anchor plate (10A) or the lower anchor plate (10B) so as to transmit, to the extension section (6a) of the flange plate (6) in the layered rubber body (8), horizontal forces resulting from horizontal relative displacement but not vertical forces resulting from vertical relative displacement.

Inventors:
Mount Umeno
Takahiro Nakajima
Oishi
Akio Suzuki
Tadashi Gomi
Kawachiyama Osamu
Application Number:
JP2014210385A
Publication Date:
January 11, 2017
Filing Date:
October 15, 2014
Export Citation:
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Assignee:
Kume Design Co., Ltd.
OILES CORPORATION
International Classes:
E04H9/02; F16F1/40; F16F15/04
Domestic Patent References:
JP2003227545A
JP2008025830A
JP2006274753A
JP3029895U
Attorney, Agent or Firm:
Jun Nakai