Title:
SUBSTRATE BREAKING DEVICE AND METHOD
Document Type and Number:
Japanese Patent JP2016198981
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate breaking device which can effectively break a substrate by heating or cooling in a scribe line direction the substrate formed with a scribe line, and can effectively break the substrate by accurately controlling heating or cooling of the substrate.SOLUTION: A substrate breaking device comprises: a first heat transmitting element for heating or cooling a first region of a substrate formed with a scribe line; and a second heat transmitting element arranged so as to be adjacent to the first heat transmitting element in the scribe line direction for cooling or heating a second region of the substrate reversely to the first region.SELECTED DRAWING: Figure 1
Inventors:
SEO YONG SIK
Application Number:
JP2015081696A
Publication Date:
December 01, 2016
Filing Date:
April 13, 2015
Export Citation:
Assignee:
MITSUBOSHI DIAMOND IND CO LTD
International Classes:
B28D5/00; B26F3/06; C03B33/033
Domestic Patent References:
| JP2002047024A | 2002-02-12 | |||
| JP2000281373A | 2000-10-10 | |||
| JP2003034545A | 2003-02-07 | |||
| JP2003034545A | 2003-02-07 | |||
| JP2000281373A | 2000-10-10 | |||
| JP2002047024A | 2002-02-12 |
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