Title:
A substrate hole formation method and a substrate hole forming device
Document Type and Number:
Japanese Patent JP6259075
Kind Code:
B2
Abstract:
According to one aspect of the present invention, provided is a method for forming a hole on a substrate comprising a base member comprising glass fiber and resin material, wherein the base member has a conductive layer formed thereon, and the method comprises: a step for exposing a part of the base member by removing a part on which the hole is to be formed among the conductive layers parts; a first resin removal step for removing the resin material by using a first flow apparatus while dipping the substrate into a first resin etching solution so as to spray the first resin etching solution at the exposed part of the base member; a glass fiber removal step for removing the glass fiber of the exposed part of the base member by spraying a glass fiber etching solution at the substrate; and a second resin removal step for removing the resin material by using a second flow apparatus while dipping the substrate into a second resin etching solution so as to spray the second resin etching solution at the exposed base member.
Inventors:
Jae Hoon Jiang
Sun Chu Kwon
Sun Chu Kwon
Application Number:
JP2016512807A
Publication Date:
January 10, 2018
Filing Date:
July 23, 2013
Export Citation:
Assignee:
Hesson DS Company Limited
International Classes:
H05K3/00; B26F1/26; H05K3/42
Domestic Patent References:
| JP6314869A | ||||
| JP2003231764A | ||||
| JP59228647A | ||||
| JP2009147323A | ||||
| JP2008013389A | ||||
| JP2011165889A | ||||
| JP2010129802A | ||||
| JP7176862A |
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinya Mitsuhiro
Tatsuhiko Abe
Shinya Mitsuhiro
Tatsuhiko Abe