SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD AND RECORDING MEDIUM

Japanese Patent JP2018074103

A

PROBLEM TO BE SOLVED: To prevent a liquid in a concave portion of a pattern from evaporating before it is substituted with a treatment fluid in a supercritical state.SOLUTION: A substrate processing device performs: a pressure-increasing step of supplying a pressurized treatment fluid into a process chamber (301) and increasing a pressure in the process chamber to a treatment pressure higher than a critical pressure of the treatment fluid after loading a substrate with a liquid deposited on its surface into a process chamber; and a circulation step of supplying a treatment fluid into the process chamber and discharging the treatment fluid from the process chamber while retaining a pressure enough for at least the treatment fluid to keep in a supercritical state in the process chamber after the pressure-increasing step. In the pressure-increasing step, at least until the pressure in the process chamber reaches the critical pressure of the treatment fluid, the supply of the treatment fluid from a second fluid supplying part (341) is stopped, and the treatment fluid is supplied from a first fluid supplying part (317) into the process chamber. In the circulation step, a treatment fluid is supplied from the second fluid supplying part into the process chamber.SELECTED DRAWING: Figure 3

GOSHI GENTARO
EGASHIRA KEISUKE
KAWABUCHI YOSUKE
KIYOSE HIROMI
MASUZUMI TAKURO
ONO HIROMOTO
TSUKANO KENTO
MARUMOTO HIROSHI
KITAYAMA SHOTARO

JP2016216313A

May 10, 2018

November 04, 2016

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TOKYO ELECTRON LTD

H01L21/304

JP2013016797A	2013-01-24
JP2013033962A	2013-02-14
JP2007049065A	2007-02-22

Hiroyuki Nagai
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Hideyuki Mori

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