Title:
A substrate processing device and a substrate treating method
Document Type and Number:
Japanese Patent JP5955766
Kind Code:
B2
Abstract:
The present invention provides a method for processing a substrate by supplying a processing liquid to the first surface of the substrate while supplying a temperature control liquid to the second surface of the substrate. The object of the present invention is to improve the temperature control performance of the temperature control liquid. A substrate processing apparatus includes a substrate holding part (10), a processing liquid nozzle (44) for supplying the processing liquid to the first surface of a substrate (W) on which a pattern is formed, a temperature control liquid nozzle (54A) for supplying a mixture of DI water and an organic solvent having compatibility with DI water and having a surface tension lower than that of DI water as the temperature control liquid to the second surface opposite to the first surface of the substrate.
Inventors:
Takayuki Tojima
Application Number:
JP2012288326A
Publication Date:
July 20, 2016
Filing Date:
December 28, 2012
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/304
Domestic Patent References:
| JP2010528470A | ||||
| JP2000058498A | ||||
| JP2007227764A | ||||
| JP2012156561A |
Foreign References:
| US20120080061 |
Attorney, Agent or Firm:
Hirohito Katsunuma
Hiroyuki Nagai
Katsuomi Isogai
Hideyuki Mori
Hiroyuki Nagai
Katsuomi Isogai
Hideyuki Mori
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