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Title:
Substrate regeneration method and imprint mold manufacturing method
Document Type and Number:
Japanese Patent JP6357749
Kind Code:
B2
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Inventors:
Takaaki Hiraka
Application Number:
JP2013201548A
Publication Date:
July 18, 2018
Filing Date:
September 27, 2013
Export Citation:
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Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
B29C33/38; B29C59/02; H01L21/027
Domestic Patent References:
JP2010109151A
JP2005532576A
JP7221006A
JP2013175671A
JP2013168604A
JP7281419A
JP6347997A
JP2007054798A
Attorney, Agent or Firm:
Masataka Ota
Junzo Yoneda



 
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