Title:
A substrate treating method and a substrate processing device
Document Type and Number:
Japanese Patent JP5963075
Kind Code:
B2
Abstract:
A substrate processing method includes a rinsing step of supplying water of a first temperature to a surface of a silicon substrate to apply a rinsing process using the water to the silicon substrate surface, a second temperature water supplying (coating) step of supplying water of a second temperature lower than the first temperature to the silicon substrate surface after the rinsing step, and a drying step of rotating the silicon substrate after the second temperature water supplying step to spin off the water on the silicon substrate surface to a periphery of the silicon substrate and thereby dry the silicon substrate.
Inventors:
Hiroaki Takahashi
Application Number:
JP2012078235A
Publication Date:
August 03, 2016
Filing Date:
March 29, 2012
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/304
Domestic Patent References:
| JP2011192885A | ||||
| JP2009267167A |
Attorney, Agent or Firm:
Inaoka cultivation
Mio Kawasaki
Goromaru Masami
Mio Kawasaki
Goromaru Masami