Title:
WATER-SOLUBLE FILM AND MEDICINE PACKAGE
Document Type and Number:
Japanese Patent JP2017100806
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a water-soluble film which has good heat sealability that adhesion, strength and the like in a heat seal portion are excellent even at a low heat seal temperature when a package is formed, and is excellent in productivity, and to provide a medicine package formed by packaging various medicines with the water-soluble film.SOLUTION: A water-soluble film which contains a PVA-based resin (A), has a breaking strength (X1) of 11.0 N/15 mm or more, when two water-soluble films overlap each other of which humidity is adjusted under environments of 23°C and 40%RH for one day, the overlapped water-soluble films is heat-sealed once under environments of a temperature of 140°C, a pressure of 0.65 MPa, a time of 1.5 times, and a seal width of 1.5 mm, then the heat sealed film is left for 2 hours under environments of 23°C and 40%RH, and the heat seal portion is peeled; and prevents interfacial peeling during peeling. A water-soluble film which contains a PVA-based resin (A), and has a breaking strength (X2) of 11.5 N/15 mm or more, when two water-soluble films overlap each other of which humidity is adjusted under environments of 23°C and 40%RH for one day, the overlapped water-soluble films is heat-sealed once under conditions of a temperature of 145°C, a pressure of 0.65 MPa, a time of 1.5 times, and a seal width of 1.5 mm, and the heat sealed film is left for 2 hours under environments of 23°C and 40%RH, and the heat seal portion is peeled; and prevents interfacial peeling during peeling.SELECTED DRAWING: None
Inventors:
HIURA TAKAHIRO
KATSUMA KATSUHIKO
KATSUMA KATSUHIKO
Application Number:
JP2016223437A
Publication Date:
June 08, 2017
Filing Date:
November 16, 2016
Export Citation:
Assignee:
NIPPON SYNTHETIC CHEM IND CO LTD:THE
International Classes:
B65D65/46; C08J5/18; C08L29/04
Domestic Patent References:
JP2000109574A | 2000-04-18 | |||
JP2001106854A | 2001-04-17 | |||
JP2004155922A | 2004-06-03 | |||
JP2004161823A | 2004-06-10 | |||
JP2007154000A | 2007-06-21 | |||
JPH09272772A | 1997-10-21 | |||
JP2013518173A | 2013-05-20 | |||
JP2005179390A | 2005-07-07 |
Foreign References:
WO2014197415A1 | 2014-12-11 | |||
US20090291282A1 | 2009-11-26 |
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