Title:
WIRE SAW AND CUTTING METHOD
Document Type and Number:
Japanese Patent JP2017104912
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a wire saw which can prevent breaking of a wire and of which a working speed can be increased.SOLUTION: A wire saw 1 comprises: an installation part 41 on which a work-piece W is installed; lower fixation rollers 36a, 36b which sandwich the installation part 41; a wire 2 which is circulated around and stretched over the lower fixation rollers 36a, 36b; lower movable rollers 37a, 37b which are hung on the wire 2 so that the wire 2 is bent in a first section K1 provided on the installation part 41 side in a circulation area between the lower fixation rollers 36a, 36b; and upper movable rollers 38a, 38b which are hung on the wire 2 so that the wire 2 is bent in a second section K2 provided on a side separated from the installation part 41 side in a circulation area between the lower fixation rollers 36a, 36b. By movements of the lower movable rollers 37a, 37b and the upper movable rollers 38a, 38b, the wire 2 in the first section K1 is shortened and approaches the installation part 41, and the wire 2 in the second section K2 is elongated.SELECTED DRAWING: Figure 4
Inventors:
ONISHI YASUSHI
UCHIYA TOMOHIRO
HIRAOKA KIYOSHI
UCHIYA TOMOHIRO
HIRAOKA KIYOSHI
Application Number:
JP2015238391A
Publication Date:
June 15, 2017
Filing Date:
December 07, 2015
Export Citation:
Assignee:
KONICA MINOLTA INC
OPTOCERAMICS:KK
SENYO KOGAKU KK
MIKUNI SEIKYO CO LTD
OPTOCERAMICS:KK
SENYO KOGAKU KK
MIKUNI SEIKYO CO LTD
International Classes:
B24B27/06
Attorney, Agent or Firm:
Sano patent office