Title:
WIRING BOARD
Document Type and Number:
Japanese Patent JP2023182871
Kind Code:
A
Abstract:
To provide a wiring board capable of suppressing high costs even when manufacturing a large or long wiring board.SOLUTION: A wiring board 1 includes a base film 10, a wiring pattern 20 arranged on the base film 10, and first and second coverlays 30 and 40 arranged side by side on the base film 10 so as to cover the wiring pattern 20, and the first coverlay 30 has an overlapping portion 301 where a portion 401 of the second coverlay 40 overlaps.SELECTED DRAWING: Figure 3
Inventors:
OTSUKA SHIGEKI
Application Number:
JP2020188570A
Publication Date:
December 27, 2023
Filing Date:
November 12, 2020
Export Citation:
Assignee:
FUJIKURA LTD
International Classes:
H05K1/02; H05K3/28
Attorney, Agent or Firm:
Patent Attorney Corporation Tokoshie Patent Office
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