Title:
配線基板
Document Type and Number:
Japanese Patent JP7385823
Kind Code:
B2
Abstract:
To provide a wiring board that does not easily deform a conductor such as a wiring of the wiring board even when the wiring board is highly elastic and maintains the reliability of electrical characteristics.SOLUTION: A wiring substrate 10 includes: a base material 20 including a first base material 21 having a first surface 211 and a second surface located on the opposite side of the first surface and having elasticity and a second base material 22 located outside an edge of the first base material and having a modulus of elasticity smaller than that of the first base material; and a conductor including a wiring 52 located on the first surface side of the first base material.SELECTED DRAWING: Figure 1
Inventors:
Naoko Okimoto
Mitsutaka Nagae
Kenichi Ogawa
Makiko Sakata
Toru Miyoshi
Mitsutaka Nagae
Kenichi Ogawa
Makiko Sakata
Toru Miyoshi
Application Number:
JP2019181025A
Publication Date:
November 24, 2023
Filing Date:
September 30, 2019
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H05K1/02; H01L23/12; H01L23/14
Domestic Patent References:
| JP2001291802A |
Foreign References:
| WO2019074105A1 |
Attorney, Agent or Firm:
Hiroyuki Nagai
Yukitaka Nakamura
Satoru Asakura
Yukihiro Hotta
Kazuo Okamura
Yukitaka Nakamura
Satoru Asakura
Yukihiro Hotta
Kazuo Okamura