Title:
3D PRINTING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/034093
Kind Code:
A1
Abstract:
Disclosed is a 3D printing method comprising the steps of: performing laser scanning on a metal powder to carry out 3D printing; and performing local stress relief step on a print, wherein the local stress relief step comprises any one of or both of: a first thermal treatment; and ultrasonic wave vibration, wherein the printing step involves decomposing the metal powder into a powder matrix, performing laser scanning on the powder matrix until the powder matrix is sintered from bottom to top into a print having a preset shape, and then performing a second thermal treatment on the print. This method is capable of selectively converting all or part of a local columnar crystal structure into an equiaxial crystal by means of recrystallization, thereby regulating and improving the microstructure and the corresponding comprehensive mechanical properties of a component made by additive manufacturing.
Inventors:
LI CHANGPENG (CN)
ZHOU ZHONGJIAO (CN)
CHEN GUOFENG (CN)
ZHOU ZHONGJIAO (CN)
CHEN GUOFENG (CN)
Application Number:
PCT/CN2018/100450
Publication Date:
February 20, 2020
Filing Date:
August 14, 2018
Export Citation:
Assignee:
SIEMENS LTD CHINA (CN)
International Classes:
B29C67/00
Foreign References:
| CN107396528A | 2017-11-24 | |||
| CN105943150A | 2016-09-21 | |||
| CN103173760A | 2013-06-26 | |||
| CN106475558A | 2017-03-08 | |||
| CN105849208A | 2016-08-10 | |||
| CN107379529A | 2017-11-24 | |||
| US20150076739A1 | 2015-03-19 |
Attorney, Agent or Firm:
KANGXIN PARTNERS, P.C. (CN)
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