Title:
ABLATION PROCESSING METHOD, ABLATION PROCESSING DEVICE, SUBSTRATE, AND METHOD FOR MANUFACTURING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2024/105861
Kind Code:
A1
Abstract:
The present invention is an ablation processing method for forming recesses in the surface of a substrate by ablation processing with the irradiation energy of a laser beam, wherein: an irradiation region in one shot of the laser beam on the substrate is made to be smaller than a to-be-processed region of the substrate, and the substrate is irradiated with a plurality of shots of the laser beam, thereby performing laser beam irradiation on the entire surface of the to-be-processed region of the substrate in the region to be processed; and in the plurality of shots of irradiation, a portion of the irradiation region in each shot is superimposed on the irradiation region of other shots in a first direction of the substrate and a second direction orthogonal to the first direction, such that recesses having a depth within a defined range are formed in the to-be-processed region of the substrate while moving the laser beam irradiation region relative to the substrate in the first direction and the second direction. The foregoing makes it possible to obtain recesses of the target depth with a simple procedure while avoiding film penetration caused by excessive processing.
Inventors:
OHTANI YOSHIKAZU (JP)
YAMAOKA HIROSHI (JP)
YAMAOKA HIROSHI (JP)
Application Number:
PCT/JP2022/042751
Publication Date:
May 23, 2024
Filing Date:
November 17, 2022
Export Citation:
Assignee:
SHIN ETSU ENG CO LTD (JP)
International Classes:
B23K26/386
Foreign References:
| JPH11504264A | 1999-04-20 | |||
| JP2009032903A | 2009-02-12 | |||
| JP2017062348A | 2017-03-30 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
Download PDF: