Title:
ABRASIVE GRAINS AND SELECTION METHOD THEREFOR, POLISHING FLUID, MULTI-COMPONENT POLISHING FLUID, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/089921
Kind Code:
A1
Abstract:
Provided is a selection method for abrasive grains, wherein the abrasive grains contain cerium and the abrasive grains are selected on the basis of the crystallite diameter thereof. Also provided are abrasive grains containing cerium and having a crystallite diameter of 30 nm or greater. Additionally provided is a polishing fluid containing the aforementioned abrasive grains and water. Also provided is a multi-component polishing fluid comprising: a first liquid containing the abrasive grains and water; and a second liquid containing the abrasive grains, a component other than water, and water. Additionally provided is a polishing method for polishing a polishing target member by using the aforementioned polishing fluid.
Inventors:
KUBO HIROMU (JP)
LEE SANGCHUL (JP)
KAGESAWA KOICHI (JP)
NOMURA SATOYUKI (JP)
LEE SANGCHUL (JP)
KAGESAWA KOICHI (JP)
NOMURA SATOYUKI (JP)
Application Number:
PCT/JP2023/017465
Publication Date:
May 02, 2024
Filing Date:
May 09, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C09K3/14; C01F17/235; H01L21/304
Domestic Patent References:
| WO2007100093A1 | 2007-09-07 | |||
| WO2018131508A1 | 2018-07-19 | |||
| WO2007055523A1 | 2007-05-18 |
Foreign References:
| JP2007154156A | 2007-06-21 | |||
| JP2015120845A | 2015-07-02 | |||
| JP2007129248A | 2007-05-24 | |||
| JP2022040139A | 2022-03-10 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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