ACTIVE COMPONENTS AND PHOTOSENSITIVE RESIN COMPOSITIONS CONTAINING THE SAME

WIPO Patent Application WO/2002/046841

A1

A photosensitive resin composition is produced by combining an active component selected from among active metal alkoxides of the general formula (1) and polycondensates thereof and particles of the general formula (2) with a photosensitizer: (1) (2) wherein X is hydrogen, halogeno, alkoxy, or alkoxycarbonyl; M is a metal atom having a valency (m) of 2 or above; U¿1? is a first connecting unit; U¿2? is a second connecting unit; Z is a group causing solubility difference through irradiation with light; P is a particulate carrier; Y is a coupling residue; n is an integer of 1 or above satisfying the relationship: m > n; p is 0 or 1; t is 1 or 2; k is an integer of 1 or above; s is 0 or 1; and the unit (U¿1?)¿p?-(U¿2?-Z)¿t? is represented by the following general formula: (3) (wherein R?1¿ and R?2¿ are each alkylene or alkenylene; B is an ester linkage, an amide linkage, a urea linkage, a urethane linkage, imino, sulfur, or nitrogen; Ar is arylene or cycloalkylene; q, r, u, and v are each 0 or 1, with the proviso that they satisfy the relationship: q + r + u + v $m(G) 1; and Z, p, and t are each as defined above).

HANABATA MAKOTO (JP)
SATO MASAHIRO (JP)
KATAYAMA JUNKO (JP)
KITAJIMA SATSUKI (JP)

PCT/JP2001/010571

June 13, 2002

December 04, 2001

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KANSAI RES INST INC (JP)
HANABATA MAKOTO (JP)
SATO MASAHIRO (JP)
KATAYAMA JUNKO (JP)
KITAJIMA SATSUKI (JP)

G03F7/038; G03F7/039; G03F7/075; (IPC1-7): G03F7/039; G03F7/004; H01L21/027

US5612170A	1997-03-18
JP2001194796A	2001-07-19

Kuwata, Mitsuo (Fuyo Building 3-19 Nishitemma 6-chome Kita-ku Osaka-shi, Osaka, JP)

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