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Title:
ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT CONNENCTOR, AND SEMICONDUCTOR DEVICES
Document Type and Number:
WIPO Patent Application WO/2007/046189
Kind Code:
A1
Abstract:
An adhesive composition comprising a thermoplastic resin, a radical-polymerizable compound, a radical polymerization initiator, a nitroxide, and a basic compound.

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Inventors:
SHIRASAKA TOSHIAKI (JP)
KATOGI SHIGEKI (JP)
IZAWA HIROYUKI (JP)
TOMIZAWA KEIKO (JP)
Application Number:
PCT/JP2006/316588
Publication Date:
April 26, 2007
Filing Date:
August 24, 2006
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
SHIRASAKA TOSHIAKI (JP)
KATOGI SHIGEKI (JP)
IZAWA HIROYUKI (JP)
TOMIZAWA KEIKO (JP)
International Classes:
C09J4/00; C09J7/00; C09J9/02; C09J11/06; H01B1/22; H01B5/16; H01L21/60; H01R11/01; H05K3/36
Domestic Patent References:
WO2005121266A12005-12-22
WO2004050779A12004-06-17
Foreign References:
JP2006257208A2006-09-28
JP2005054140A2005-03-03
JP2002167556A2002-06-11
JP2002167555A2002-06-11
JP2002164389A2002-06-07
JPH1135647A1999-02-09
JP2001294557A2001-10-23
Attorney, Agent or Firm:
HASEGAWA, Yoshiki et al. (Ginza First Bldg. 10-6 Ginza 1-chome, Chuo-k, Tokyo 61, JP)
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