Title:
ADHESIVE AND CONNECTION STRUCTURE USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2008/065997
Kind Code:
A1
Abstract:
Disclosed is an adhesive containing a thermoplastic resin (a), a radically polymerizable compound (b), a urea compound (c) represented by the general formula (10) below, a radical polymerization initiator (d), and an acidic compound (e).
Inventors:
KATOGI SHIGEKI (JP)
KUDOU SUNAO (JP)
IZAWA HIROYUKI (JP)
SHIRASAKA TOSHIAKI (JP)
KUDOU SUNAO (JP)
IZAWA HIROYUKI (JP)
SHIRASAKA TOSHIAKI (JP)
Application Number:
PCT/JP2007/072763
Publication Date:
June 05, 2008
Filing Date:
November 26, 2007
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
KATOGI SHIGEKI (JP)
KUDOU SUNAO (JP)
IZAWA HIROYUKI (JP)
SHIRASAKA TOSHIAKI (JP)
KATOGI SHIGEKI (JP)
KUDOU SUNAO (JP)
IZAWA HIROYUKI (JP)
SHIRASAKA TOSHIAKI (JP)
International Classes:
C09J4/00; C09J7/00; C09J9/02; C09J11/06; H05K1/14; H05K3/36
Domestic Patent References:
| WO2007083623A1 | 2007-07-26 |
Foreign References:
| JP2005123025A | 2005-05-12 | |||
| JP2003089775A | 2003-03-28 | |||
| JP2005054140A | 2005-03-03 | |||
| JPS6024826B2 | 1985-06-14 |
Attorney, Agent or Firm:
HASEGAWA, Yoshiki et al. (Ginza First Bldg.10-6 Ginza 1-chom, Chuo-ku Tokyo, JP)
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