Title:
ADHESIVE FILM FOR BACK GRINDING , AND ELECTRONIC DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/019158
Kind Code:
A1
Abstract:
An adhesive film (50) that is for back grinding, is used for protecting the surface of an electronic component (30), and comprises a base material layer (10) and a UV ray curable adhesive resin layer (20) provided on one surface of the base material layer (10), wherein the 60° peel strength of the adhesive film (50), as measured using the following method, after being irradiated with UV rays is 0.4N/25mm to 5.0N/25mm, inclusive. (Method) The adhesive film (50) is affixed to a silicon mirror wafer so that the adhesive resin layer (20) is in contact with the silicon mirror wafer. Subsequently, a high-pressure mercury lamp is used to irradiate the adhesive film (50) in an environment of 25°C with UV rays having a main wavelength of 365nm at an irradiation intensity of 100 mW/cm2 and a UV ray amount of 1,080 mJ/cm2, thereby UV curing the adhesive resin layer (20). Then, a tensile testing machine is used to peel the adhesive film (50) from the silicon mirror wafer at 23°C and a speed of 150 mm/min in a 60° direction, and the strength (N/25mm) at that time serves as the 60° peel strength.
Inventors:
YASUI HIROTO (JP)
KURIHARA HIROYOSHI (JP)
KINOSHITA JIN (JP)
KURIHARA HIROYOSHI (JP)
KINOSHITA JIN (JP)
Application Number:
PCT/JP2021/026094
Publication Date:
January 27, 2022
Filing Date:
July 12, 2021
Export Citation:
Assignee:
MITSUI CHEMICALS TOHCELLO INC (JP)
International Classes:
C09J201/00; C09J7/38; H01L21/301; H01L21/304
Domestic Patent References:
| WO2019189069A1 | 2019-10-03 |
Foreign References:
| JP2016072546A | 2016-05-09 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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