ADHESIVE FILM AND METHOD FOR PRODUCING THE SAME

WIPO Patent Application WO/2005/068573

A1

An adhesive film (4) having a first resin layer (10), a second resin layer (20) formed on the front surface of the first resin layer (10), and a third resin layer (15) formed on the rear surface of the first resin layer (10), wherein the lowest viscosity in the temperature range lower than the bonding temperature of the first resin layer (10) is higher than the lowest viscosity in the temperature range lower than the bonding temperature of the second and third resin layers (20, 25). When first and second bodies (40, 50) to be bonded are hot pressed while sandwiching the adhesive film (4), the second resin layer (20) flows out toward the outside of the body (50). However, since the first resin layer (10) containing conductive particles (12) does not flow out but stays between the first and second bodies (40, 50), the number of conductive particles (12) sandwiched between first and second connection terminals (42, 52) increases.

KUDO NORIAKI (JP)
AKUTSU YASUSHI (JP)
NAMIKI HIDETSUGU (JP)

PCT/JP2004/019527

July 28, 2005

December 27, 2004

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SONY CHEMICALS CORP (JP)
KUDO NORIAKI (JP)
AKUTSU YASUSHI (JP)
NAMIKI HIDETSUGU (JP)

B32B27/18; B32B27/08; C09J7/29; C09J9/02; C09J201/00; H01B5/16; H01B13/00; H01L21/60; H05K3/32; (IPC1-7): C09J7/02; B32B27/08

WO1998038261A1

1998-09-03

JP2000178511A	2000-06-27
JP2004006417A	2004-01-08
JP2002358825A	2002-12-13

Ishijima, Shigeo (3F 2-18, Toranomon 1-chom, Minato-ku Tokyo 01, JP)

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