ADHESIVE FILM AND SEMICONDUCTOR DEVICE USING SAME

Title:

ADHESIVE FILM AND SEMICONDUCTOR DEVICE USING SAME

Document Type and Number:

WIPO Patent Application WO/2007/018120

Kind Code:

A1

Abstract:

Disclosed is an adhesive film containing a polyimide resin (A) and a thermosetting resin (B), which is characterized in that the polyimide resin (A) contains a polyimide resin having a repeating unit represented by the formula (I) below and the storage modulus at 250˚C after being heat treated at 150-230˚C for 0.3-5 hours is not less than 0.2 MPa. (I) (In the formula, m-number of R1's independently represent a divalent organic group and k-number of organic groups selected from -CH2-, -CHR- and -CR2- (wherein R represents a non-cyclic alkyl group having 1-5 carbon atoms) are included in total in the m-number of R1's; m is an integer of not less than 8, and m and k satisfy the relation of k/m ≥ 0.85; and R2 represents a residue of a tetracarboxylic acid.)

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Inventors:

KITAKATSU TSUTOMU

Application Number:

PCT/JP2006/315399

Publication Date:

February 15, 2007

Filing Date:

August 03, 2006

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD (JP)
KITAKATSU TSUTOMU

International Classes:

C09J7/10; C09J163/00; C09J179/08

Domestic Patent References:

WO2003018703A1

2003-03-06

Foreign References:

JP2004292821A	2004-10-21
JP2004211053A	2004-07-29
JP2003327925A	2003-11-19

Other References: