Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ADHESIVE LAMINATED FILM AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/235389
Kind Code:
A1
Abstract:
Provided is an adhesive laminated film (50) used to protect circuit-forming surfaces of electronic components, the adhesive laminated film (50) comprising a base layer (20), a concave-convex absorbent resin layer (30), and an adhesive resin layer (40) in this order, wherein the concave-convex absorbent resin layer (30) contains an ethylene-based copolymer having a melting point of 40-80°C and a crosslinking agent, and the content of the crosslinking agent in the concave-convex absorbent resin layer (30) is 0.06-0.60 parts by mass with respect to 100 parts by mass of the ethylene-based copolymer.

More Like This:
WO/2012/090980CURABLE RESIN COMPOSITION, CURED PRODUCT, SURFACE-PROCESSED CURED PRODUCT, AND LAMINATE
WO/2014/131372IN-MOLD LABEL FOR USE IN STRETCH BLOW MOLDING AND STRETCH BLOW MOLDING-MOLDED PRODUCT HAVING THE LABEL
JP2604366[Title of Invention] Paint Complex
Inventors:
UNEZAKI TAKASHI (JP)
KAI TAKASHI (JP)
MUROFUSHI TAKANOBU (JP)
KINOSHITA JIN (JP)
Application Number:
PCT/JP2021/018599
Publication Date:
November 25, 2021
Filing Date:
May 17, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUI CHEMICALS TOHCELLO INC (JP)
International Classes:
B32B27/00; B32B27/26; B32B27/32; B32B27/36; C09J7/24; C09J7/29; C09J7/38; C09J201/00; H01L23/00
Domestic Patent References:
WO2019017226A12019-01-24
WO2019017225A12019-01-24
WO2020059572A12020-03-26
WO2017169958A12017-10-05
WO2017061132A12017-04-13
WO2020203089A12020-10-08
WO2020175364A12020-09-03
Foreign References:
JP2018006540A2018-01-11
JP2019161031A2019-09-19
KR20200024591A2020-03-09
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: FURNACE MONITORING DEVICE

Next Patent: ANTI-SARS-COV-2 DRUG