ADHESIVE SHEET FOR WAFER PROTECTION

WIPO Patent Application WO/2015/111310

A1

Provided is an adhesive sheet for wafer protection (1a), which comprises a base (11), an intermediate layer (12) and an adhesive layer (13) in this order, and wherein: the intermediate layer is formed from an intermediate layer-forming composition that contains 100 parts by mass of a non-energy ray-curable acrylic polymer (A) and 25 parts by mass or more of an energy ray-curable acrylic polymer (B) having a mass average molecular weight of from 50,000 to 250,000; and the adhesive layer is formed from an adhesive composition that contains an energy ray-curable acrylic polymer (C). Since this adhesive sheet for wafer protection has excellent adhesion between the intermediate layer and the adhesive layer after irradiation of an energy ray, adherence of a residue of the adhesive layer to an object to be bonded can be suppressed if the adhesive sheet is released from the object again after the bonding. This adhesive sheet for wafer protection exhibits excellent followability to an object to be bonded that has a wafer surface having recesses and projections with large differences, and is small in change of the adhesive force even after long-term storage, thereby exhibiting excellent long-term stability.

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ENOKI SAYAKA (JP)
MORITA YUKI (JP)

PCT/JP2014/082017

July 30, 2015

December 03, 2014

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LINTEC CORP (JP)

C09J7/29; H01L21/301; C09J4/02; C09J133/00; H01L21/304; H01L21/683

JP2007084722A	2007-04-05
JP2004331743A	2004-11-25
JP2010287819A	2010-12-24

OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)

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