Title:
AGCU-BASED CONDUCTIVE FILLER POWDER
Document Type and Number:
WIPO Patent Application WO/2015/053222
Kind Code:
A1
Abstract:
Provided is an AgCu-based conductive filler powder which is used for a conductive adhesive. This AgCu-based conductive filler powder is an atomized alloy powder which is formed of a Cu-Ag alloy having an Ag content of 1-30% by mass. This atomized alloy powder remains in the atomized state and has an AgCu phase having a mass ratio X of Ag to Cu (MAg/MCu) of 1.2 or more in the atomized powder outermost layer. This powder outermost layer is a layer from the powder outermost surface to 20 nm deep of the atomized alloy powder. According to the present invention, there is provided an AgCu-based conductive filler powder which has electrical conductivity equivalent to that of pure Ag and remains in the atomized alloy powder state without having necessity for Ag coating.
Inventors:
KUSE TETSUJI (JP)
KARIYA TETSURO (JP)
YAMAMOTO TAKAHISA (JP)
KARIYA TETSURO (JP)
YAMAMOTO TAKAHISA (JP)
Application Number:
PCT/JP2014/076704
Publication Date:
April 16, 2015
Filing Date:
October 06, 2014
Export Citation:
Assignee:
SANYO SPECIAL STEEL CO LTD (JP)
International Classes:
B22F1/00; B22F9/08; C22C9/00; H01B5/00
Foreign References:
| JPH07331360A | 1995-12-19 | |||
| JPH1030103A | 1998-02-03 | |||
| JPH09302403A | 1997-11-25 | |||
| JPH09219112A | 1997-08-19 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
Masaharu Takamura (JP)
Masaharu Takamura (JP)
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