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Patent Searching and Data


Title:
ALUMINUM ELECTROPLATING SOLUTION
Document Type and Number:
WIPO Patent Application WO/2012/141136
Kind Code:
A1
Abstract:
Provided is an aluminum electroplating solution which is highly soluble in non-aqueous solvents and whereby the quantity of electricity conducted in electroplating can be increased and aluminum electroplating can be carried out efficiently and in a short period of time, producing a smooth, glossy plating film. This aluminum electroplating solution is characterized in including an ionic solution comprising an ionic pair of an aluminum metal salt and an organic compound, an organic solvent having a relative permittivity of no more than 8, and an additive that is an aromatic sulfonimide or an N-cyclic compound. Preferably, the organic solvent is hexane, toluene, diethyl ether, ethyl acetate, cyclohexane, xylene, benzene, naphthalene, heptane, cyclopentyl methyl ether, dioxane, or a mixed solvent comprising any one of these solvents.

Inventors:
HARADA MOTOKO (JP)
NEGISHI YOSHINORI (JP)
NAKANO HIROSHI (JP)
AKAHOSHI HARUO (JP)
Application Number:
PCT/JP2012/059686
Publication Date:
October 18, 2012
Filing Date:
April 09, 2012
Export Citation:
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Assignee:
HITACHI LTD (JP)
HARADA MOTOKO (JP)
NEGISHI YOSHINORI (JP)
NAKANO HIROSHI (JP)
AKAHOSHI HARUO (JP)
International Classes:
C25D3/44; C25D7/08
Foreign References:
JP2009173977A2009-08-06
JP2009197318A2009-09-03
JP2005159045A2005-06-16
JP2005243740A2005-09-08
JP2005277380A2005-10-06
Attorney, Agent or Firm:
POLAIRE I. P. C. (JP)
Polaire Intellectual Property Corporation (JP)
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Claims: