Title:
ANISOTROPIC CONDUCTIVE ADHESIVE AND METHOD OF ELECTRODE CONNECTION THEREWITH
Document Type and Number:
WIPO Patent Application WO/2006/093315
Kind Code:
A1
Abstract:
An anisotropic conductive adhesive that realizes secure connection to joining terminals of fine pitch; and a method of electrode connection with the use of the same. There is provided anisotropic conductive adhesive (1) comprising insulating adhesive resin (6) and, dispersed therein, foam component (8) capable of foaming upon heating and conductive particles (7). The foam component (8) is dispersed in the insulating adhesive resin (6) so as to be able to form independent foams. As the foam component (8), use is made of those containing microparticles having an organic solvent sealed in thermoplastic microcapsules.
Inventors:
KONISHI MISAO (JP)
Application Number:
PCT/JP2006/304278
Publication Date:
September 08, 2006
Filing Date:
March 06, 2006
Export Citation:
Assignee:
SONY CHEMICALS CORP (JP)
KONISHI MISAO (JP)
KONISHI MISAO (JP)
International Classes:
C09J201/00; C09J5/08; C09J7/00; C09J9/02; C09J11/00; H01B5/16; H01L21/60; H01R11/01
Foreign References:
| JP2000215729A | 2000-08-04 | |||
| JPS51135938A | 1976-11-25 | |||
| JP2001107019A | 2001-04-17 | |||
| JPS51114439A | 1976-10-08 | |||
| JPS51109936A | 1976-09-29 |
Attorney, Agent or Firm:
Abe, Hideki (3F 1-2-18, Toranomo, Minato-ku Tokyo, JP)
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