Title:
ANISOTROPIC CONDUCTIVE MATERIAL AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2012/074015
Kind Code:
A1
Abstract:
Provided are an anisotropic conductive material with which low conduction resistance and high adhesive strength can be obtained and a method for manufacturing the same. After a glass substrate (11) and a metal wiring material (12) are thermocompression bonded, the Si of the glass substrate (11) surface and an alkoxyl group (OR) with a disulfide silane terminal modified by hydrophobic silica (14) are reacted and chemically bonded at the interface of the glass substrate (11) and an anisotropic conductive material (13). In addition, at the interface of the metal wiring material (12) and the anisotropic conductive material (13), some S-S bonds (disulfide bonds) of the disulfide silane are dissociated by the heat during the compression attachment, and the dissociated sulfide silane chemically bonds with the metal (Me).
Inventors:
TSUKAO REIJI (JP)
ISHIMATSU TOMOYUKI (JP)
OZEKI HIROKI (JP)
ISHIMATSU TOMOYUKI (JP)
OZEKI HIROKI (JP)
Application Number:
PCT/JP2011/077689
Publication Date:
June 07, 2012
Filing Date:
November 30, 2011
Export Citation:
Assignee:
SONY CHEM & INF DEVICE CORP (JP)
TSUKAO REIJI (JP)
ISHIMATSU TOMOYUKI (JP)
OZEKI HIROKI (JP)
TSUKAO REIJI (JP)
ISHIMATSU TOMOYUKI (JP)
OZEKI HIROKI (JP)
International Classes:
H01B5/16; H01B1/22; H01L21/60; H01R11/01; H05K1/14; H05K3/32
Foreign References:
| JP2010232191A | 2010-10-14 | |||
| JP2010171023A | 2010-08-05 | |||
| JP2009280790A | 2009-12-03 | |||
| JP2009212077A | 2009-09-17 | |||
| JP2002322348A | 2002-11-08 |
Attorney, Agent or Firm:
KOIKE, Akira et al. (JP)
Akira Koike (JP)
Akira Koike (JP)
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Claims:
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