APPARATUS FOR PLATING CYLINDER

Title:

APPARATUS FOR PLATING CYLINDER

Document Type and Number:

WIPO Patent Application WO/2012/043513

Kind Code:

A1

Abstract:

Provided is an apparatus for plating a cylinder, wherein service life of the whole apparatus can be improved with a technology of plating a cylinder, hardness nonuniformity of the plating layer on the cylinder surface can be eliminated by making the hardness uniform, and oxidation of the tip of a chuck means can be suppressed. The apparatus for plating a cylinder is provided with: a plating tank filled with a plating solution; a chuck means, which stores a long cylinder in the plating tank by rotatably and conductively holding both the cylinder ends in the longitudinal direction; and a pair of insoluble electrodes, which faces each other, is vertically installed to face both the side surfaces of the cylinder in the plating tank, and which has a predetermined current carried thereto. A thermal cooling means is provided in the chuck means, and the cylinder holding section of the chuck means is cooled by making the thermal cooling means have a cooling medium, and circulating the cooling medium, and heat accumulation in the cylinder, especially at the cylinder end portions, and at the cylinder holding section of the chuck means can be eliminated.

Inventors:

SHIGETA TATSUO (JP)

Application Number:

PCT/JP2011/071960

Publication Date:

April 05, 2012

Filing Date:

September 27, 2011

Export Citation:

Click for automatic bibliography generation Help

Assignee:

THINK LABS KK (JP)
SHIGETA TATSUO (JP)

International Classes:

C25D17/06; C25D7/00; C25D7/04; C25D17/08

Domestic Patent References:

WO2006126518A1	2006-11-30
WO2006126518A1	2006-11-30

Foreign References:

JP2009543950A	2009-12-10
JPS5736995B2	1982-08-06
JPH01161488A	1989-06-26
JP2005029876A	2005-02-03
JP2005133139A	2005-05-26
JP2007224321A	2007-09-06

Other References: