Title:
ARTIFICIAL INTELLIGENCE-DRIVEN INTELLIGENT SOLDER-MASK REMOVING APPARATUS USING LASER TO REMOVE SOLDER MASK LAYER OF SUBSTRATE, AND METHOD
Document Type and Number:
WIPO Patent Application WO/2024/114223
Kind Code:
A1
Abstract:
Disclosed in the present invention are an artificial intelligence-driven intelligent solder-mask removing apparatus using a laser to remove a solder mask layer of a substrate, and a method. The apparatus comprises an artificial intelligence (AI) system, a control processing module, a photographic image-capturing module and a laser solder-mask removing module. The artificial intelligence system comprises a database unit, a learning and training unit, a parameter optimization and setting unit, a condition limiting unit and an AI model processing unit. The artificial intelligence (AI) system is used for performing learning and pre-training with respect to the type of substrates, the size of the substrates, the thickness of the substrates, the color of solder mask layers, the thickness of the solder mask layers and the depths around bonding pads, and automatically optimizing and setting all processing parameters according to the features of the substrates to be processed. The artificial intelligence (AI) system controls the laser solder-mask removing module to laser-remove the solder masks of the substrates according to a first control instruction and a circuit layout diagram.
Inventors:
PANG PEI-CHUNG (CN)
Application Number:
PCT/CN2023/127786
Publication Date:
June 06, 2024
Filing Date:
October 30, 2023
Export Citation:
Assignee:
T TOP TECH OPTICAL CO LTD (CN)
PANG PEI CHUNG (CN)
PANG PEI CHUNG (CN)
International Classes:
H05K3/28
Foreign References:
| CN115696773A | 2023-02-03 | |||
| CN116471758A | 2023-07-21 | |||
| KR100815361B1 | 2008-03-19 | |||
| KR20080092783A | 2008-10-16 | |||
| CN101170069A | 2008-04-30 |
Attorney, Agent or Firm:
KELONG INTERNATIONAL INTELLECTUAL PROPERTY AGENT LTD. (CN)
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