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Title:
AUTOMATED BALL-PLANTING TESTING SYSTEM USING WELDING BALL ARRAY PACKAGING
Document Type and Number:
WIPO Patent Application WO/2023/134168
Kind Code:
A1
Abstract:
An automated ball-planting testing system using welding ball array packaging, the ball-planting testing system comprising a Z-axis movable self-focusing visual unit (100), a mechanical arm and a TCP unit (200) thereof, an XY-W motion platform unit (300), a machine frame (400) and an outer cover (500), wherein the XY-W motion platform unit (300) is mounted in the middle of the machine frame (400); the Z-axis movable self-focusing visual unit (100), and the mechanical arm and the TCP unit (200) thereof are mounted on two sides of the XY-W motion platform unit (300); and the outer cover (500) is sleeved on the machine frame (400). By means of the automated ball-planting testing system using welding ball array packaging, chip products of various specifications can be compatible, and a product can be driven by means of a platform to be imaged multiple times under a camera, thereby achieving splicing.

Inventors:
LIN HAITAO (CN)
LIANG MENG (CN)
ZHAO KAI (CN)
LV ZHIWEI (CN)
SU HAOJIE (CN)
HUANG YONGFENG (CN)
Application Number:
PCT/CN2022/112743
Publication Date:
July 20, 2023
Filing Date:
August 16, 2022
Export Citation:
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Assignee:
SHANGHAI TECHSENSE CO LTD (CN)
International Classes:
G01N21/956; G01N21/13; G01N21/88; G01N35/10; H01L21/66; H01L21/67
Domestic Patent References:
WO2015080669A12015-06-04
Foreign References:
CN114441555A2022-05-06
CN105436095A2016-03-30
JP2002057196A2002-02-22
CN113058874A2021-07-02
CN214844900U2021-11-23
CN106981437A2017-07-25
Attorney, Agent or Firm:
DUAN&DUAN LAW FIRM (CN)
Download PDF:
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