Title:
BIOMETRIC INFORMATION RECOGNITION MODULE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/279700
Kind Code:
A1
Abstract:
The present application provides a biometric information recognition module and an electronic device, and relates to the technical field of electronic devices. The biometric information recognition module comprises an optical path guiding layer and a photosensitive pixel array which are arranged in sequence. The optical path guiding layer comprises a plurality of optical channels. The photosensitive pixel array comprises a plurality of photosensitive pixel units, and beams carrying biometric information each pass through an optical channel and are then incident on a corresponding photosensitive pixel unit, the light path guiding layer comprising a central region and a peripheral region surrounding the central region, and an included angle being formed between an optical channel in the peripheral region and a first straight line perpendicular to the surface of the photosensitive pixel array. By means of the modular structural design of optical elements, the range of biometric information collection can be expanded for a biometric information recognition module under the existing structure size, thus, under existing area requirements for biometric information collection, the accuracy of biometric information recognition is ensured, and the structure size of the biometric information recognition module is reduced.
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Inventors:
SUN JIANCHENG (CN)
Application Number:
PCT/CN2022/072813
Publication Date:
January 12, 2023
Filing Date:
January 19, 2022
Export Citation:
Assignee:
BEIJING JIIOV TECH CO LTD (CN)
International Classes:
G06K9/00
Foreign References:
| CN113553925A | 2021-10-26 | |||
| CN111881873A | 2020-11-03 | |||
| CN110582780A | 2019-12-17 | |||
| CN107480661A | 2017-12-15 |
Attorney, Agent or Firm:
CHOFN INTELLECTUAL PROPERTY (CN)
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