BLISTER PACKAGING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING BLISTER PACKAGING BODY

WIPO Patent Application WO/2006/109885

A1

A blister packaging material, a method of manufacturing the blister packaging material, and a method of manufacturing a blister packaging body. The blister packaging material comprises two sheets of front and rear synthetic resin films and a blister part having a flange at its peripheral edge. The blister packaging material is characterized in that a window hole is formed in the front film and a blister is projected through the window hole from the inside. The method of manufacturing the blister packaging body is characterized by comprising a step for unwinding a long synthetic resin film, a step for opening the window hole in the film, a step for fitting the blister with the flange at its peripheral edge downward into the window hole, a step for charging a commodity in the blister, a step for covering the blister part by the rear film, and a step for melt-cutting the blister packaging material in which the commodity is stored in units of the packaging material. The blister packaging body having these features above can be efficiently manufactured in both a small lot production and a mass production.

YAMAGATA ICHIKI (JP)

PCT/JP2006/308010

October 19, 2006

April 11, 2006

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YAMAGATA GRAVURE CO LTD (JP)
YAMAGATA ICHIKI (JP)

B65D75/36; B65B7/28

JPH07232761A	1995-09-05
JPH10181769A	1998-07-07
JP2002370773A	2002-12-24
JPH09118363A	1997-05-06
JPH05112381A	1993-05-07

Uchiyama, Mitsuru (4-1 Kandasudacho 1-chome, Chiyoda-k, Tokyo 41, JP)

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