Title:
BONDING COMPENSATION METHOD AND APPARATUS, CHIP REWIRING METHOD, AND BONDING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/016555
Kind Code:
A1
Abstract:
Embodiments of the present application provide a bonding compensation method and apparatus, a chip rewiring method, and a bonding structure. The compensation method comprises: providing at least one bottom chip, wherein a plurality of top chips are bonded on the bottom chip; acquiring the offset of the actual bonding position of each top chip relative to the bottom chip, and preset error precision of an arrangement position, where a rewiring layer is to be formed, on each top chip relative to the bottom chip; and constructing a compensation amount, containing a pre-compensation parameter, for the arrangement position of said rewiring layer relative to each top chip, and calculating the pre-compensation parameter by taking the preset error precision as a boundary condition, wherein the pre-compensation parameter is a compensation parameter for the arrangement position of said rewiring layer relative to the bottom chip.
Inventors:
LIU TIANJIAN (CN)
TIAN YINGCHAO (CN)
CAO RUIXIA (CN)
WANG YIQUN (CN)
LIU SHUJUAN (CN)
TIAN YINGCHAO (CN)
CAO RUIXIA (CN)
WANG YIQUN (CN)
LIU SHUJUAN (CN)
Application Number:
PCT/CN2022/135834
Publication Date:
January 25, 2024
Filing Date:
December 01, 2022
Export Citation:
Assignee:
HUBEI 3D SEMICONDUCTOR INTEGRATED INNOVATION CENTER CO LTD (CN)
HUBEI YANGTZE MEMORY LABORATORIES (CN)
HUBEI YANGTZE MEMORY LABORATORIES (CN)
International Classes:
H01L21/60; H01L21/66; H01L23/485
Foreign References:
| CN114678282A | 2022-06-28 | |||
| CN114005778A | 2022-02-01 | |||
| CN112185870A | 2021-01-05 | |||
| CN112530815A | 2021-03-19 | |||
| CN112331592A | 2021-02-05 | |||
| CN114284164A | 2022-04-05 |
Attorney, Agent or Firm:
CHINA PAT INTELLECTUAL PROPERTY OFFICE (CN)
Download PDF: