Title:
BONDING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2014/057633
Kind Code:
A1
Abstract:
Provided is a heat-resistant bonding composition in which high bonding strength is achieved by a comparatively low-temperature and pressureless bond, and there is not likely to be a decreases in bonding strength due to problems such as decomposition and deterioration of a resin component during an increase in the operating temperature; particularly a bonding composition including metal particles. The bonding composition contains inorganic metal particles, and an organic component including unsaturated hydrocarbons and an amine having a carbon number of 4 to 7.
Inventors:
WATANABE TOMOFUMI (JP)
SHIMOYAMA KENJI (JP)
SHIMOYAMA KENJI (JP)
Application Number:
PCT/JP2013/005906
Publication Date:
April 17, 2014
Filing Date:
October 03, 2013
Export Citation:
Assignee:
BANDO CHEMICAL IND (JP)
International Classes:
B22F1/00; B22F1/102; B82Y30/00; H01L21/52; B22F1/054; B22F1/107; B22F9/24; B23K35/22
Domestic Patent References:
| WO2012105682A1 | 2012-08-09 | |||
| WO2008062548A1 | 2008-05-29 | |||
| WO2007034833A1 | 2007-03-29 |
Foreign References:
| JPH04146975A | 1992-05-20 | |||
| JP2011095244A | 2011-05-12 | |||
| JP2012046779A | 2012-03-08 | |||
| JP2008063688A | 2008-03-21 | |||
| JP2012046779A | 2012-03-08 |
Other References:
See also references of EP 2907602A4
Attorney, Agent or Firm:
NAKA, Koichi (JP)
Relations Koichi (JP)
Relations Koichi (JP)
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