BONDING MATERIAL AND BONDING METHOD USING SAME - DOWA ELECTRONICS MATERIALS CO

Title:

BONDING MATERIAL AND BONDING METHOD USING SAME

Document Type and Number:

WIPO Patent Application WO/2016/035314

Kind Code:

A1

Abstract:

Provided are: an inexpensive bonding material which can be printed easily on an object to be bonded and does not cause the formation of voids in a bonded part between objects to be bonded to each other; and a bonding method using the bonding material. A bonding material comprising a copper paste, wherein the copper paste comprises a copper powder containing 0.3% by mass or less of carbon and having an average particle diameter of 0.1 to 1 μm and an alcoholic solvent such as a monohydric alcohol, a diol, a triol and a terpene-type alcohol, and wherein the content of the copper powder is 80 to 95% by mass and the content of the alcoholic solvent is 5 to 20% by mass.

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Inventors:

ENDOH KEIICHI (JP)
MIYOSHI HIROMASA (JP)
MOTOMURA KIMIKAZU (JP)
KURITA SATORU (JP)

Application Number:

PCT/JP2015/004401

Publication Date:

March 10, 2016

Filing Date:

August 31, 2015

Export Citation:

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Assignee:

DOWA ELECTRONICS MATERIALS CO (JP)

International Classes:

B22F1/00; B22F7/08; B22F9/00; B23K20/00; C22C9/00; H01L21/52; H05K3/32

Domestic Patent References:

WO2007034893A1

2007-03-29

Other References: