Title:
BONDING PASTE, BONDED BODY, AND METHOD FOR PRODUCING BONDED BODY
Document Type and Number:
WIPO Patent Application WO/2024/106298
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a bonding paste which uses silver particles and enables pressureless bonding, while achieving excellent bonding strength and being suppressed in decrease of the bonding strength associated with temperature cycles; a bonded body which uses this bonding paste; and a method for producing a bonded body. The problem is solved by: a bonding paste which contains (A) silver particles that have an average particle diameter of 100 nm to 500 nm, (B) a compound which comprises at least one kind of nitrogen atom selected from the group consisting of a secondary nitrogen atom and a tertiary nitrogen atom, and four or more hydroxyl groups, and (C) a dispersion medium; and a bonded body and a method for producing a bonded body, each of which uses this bonding paste.
Inventors:
TANAKA NAOHIRO (JP)
UESUGI TAKAHIKO (JP)
UESUGI TAKAHIKO (JP)
Application Number:
PCT/JP2023/040336
Publication Date:
May 23, 2024
Filing Date:
November 09, 2023
Export Citation:
Assignee:
ARTIENCE CO LTD (JP)
International Classes:
B22F7/08; B22F1/00; B22F1/05; B22F1/102; B22F1/107; B22F9/00; H01B1/22; H01L21/52
Domestic Patent References:
| WO2021166627A1 | 2021-08-26 |
Foreign References:
| JP2022099238A | 2022-07-04 | |||
| JP2014074132A | 2014-04-24 | |||
| JP2022117824A | 2022-08-12 |
Attorney, Agent or Firm:
IEIRI Takeshi (JP)
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